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authorFrieder Schrempf <frieder.schrempf@kontron.de>2021-08-30 15:02:10 +0200
committerGreg Kroah-Hartman <gregkh@linuxfoundation.org>2021-09-03 10:09:28 +0200
commitded6da217ced636f757051baa98a2564d7ec8100 (patch)
tree36aebeb5793eb5f4f5575ebe97c2394c0005a787 /net/tipc
parent3b2018f9c9c088741d7d33a2baf9aa39e93d58c5 (diff)
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mtd: spinand: Fix incorrect parameters for on-die ECC
The new generic NAND ECC framework stores the configuration and requirements in separate places since commit 93ef92f6f422 ("mtd: nand: Use the new generic ECC object"). In 5.10.x The SPI NAND layer still uses only the requirements to track the ECC properties. This mismatch leads to values of zero being used for ECC strength and step_size in the SPI NAND layer wherever nanddev_get_ecc_conf() is used and therefore breaks the SPI NAND on-die ECC support in 5.10.x. By using nanddev_get_ecc_requirements() instead of nanddev_get_ecc_conf() for SPI NAND, we make sure that the correct parameters for the detected chip are used. In later versions (5.11.x) this is fixed anyway with the implementation of the SPI NAND on-die ECC engine. Cc: stable@vger.kernel.org # 5.10.x Reported-by: voice INTER connect GmbH <developer@voiceinterconnect.de> Signed-off-by: Frieder Schrempf <frieder.schrempf@kontron.de> Acked-by: Miquel Raynal <miquel.raynal@bootlin.com> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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