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android_hardware_qcom_sdm845_thermal
lineage-16.0
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lineage-16.0
Merge branch 'qcom/release/LA.UM.7.3.9.08.00.00.385.328' into pi-dev
aaronding
6 years
Age
Commit message
Author
Files
Lines
2018-05-25
Merge branch 'qcom/release/LA.UM.7.3.9.08.00.00.385.328' into pi-dev
HEAD
lineage-16.0
aaronding
1
-0
/
+1
2018-05-02
Fix VNDK Compilation Errors
Vinay Verma
1
-1
/
+1
2018-04-19
thermal-hal: Use header libraries for AOSP project header reference
Manaf Meethalavalappu Pallikunhi
1
-0
/
+1
2018-03-27
Make thermal.$TARGET_BOARD_PLATFORM build with the VNDK.
Steven Moreland
4
-3
/
+4
2017-12-21
Merge remote-tracking branch 'goog/qcom/release/LA.UM.7.3.9.00009.1'
Alexey Polyudov
2
-1
/
+44
2017-11-08
Merge remote-tracking branch 'goog/qcom/release/LA.UM.6.3.R1.003751.1'
Alexey Polyudov
4
-0
/
+608
2017-11-07
Initial empty repository
kuantung
0
-0
/
+0
2017-11-02
Add default Thermal HAL module for target which doesn't support VR
Manaf Meethalavalappu Pallikunhi
2
-1
/
+44
2017-10-09
Merge e4e88d563b7c82869a61075d51386546dc202156 on remote branch
Linux Build Service Account
4
-1
/
+207
2017-09-21
Changes of Thermal HAL on SDM845
Rohit Bandi
4
-1
/
+207
[...]
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https://git.replicant.us/mirrors/LineageOS/android_hardware_qcom_sdm845_thermal